以600mm×600mm面板为例，其面积是12英寸晶圆载板的5.1倍，单片产出芯片数量大幅增加。同时，FOPLP的面积利用率超95%，显著优于传统晶圆级封装的85%，同等面积下面板可多容纳1.64倍芯片。基板面积增大持续降低成本，200mm向300mm过渡节约25%成本，300mm向板级封装过渡更可节约66%成本。
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Work toward Gateway, a small space station that would orbit the moon and serve as a staging point for future missions, is not going away, officials said. But they made clear the agency’s priority is getting Artemis flights off the ground more often before building out that lunar outpost.，这一点在im钱包官方下载中也有详细论述
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